Due to its ultra-thin form factor and excellent heat dissipation
characteristics this is the perfect module for integration in small
consumer electronics devices or broadband M2M applications. The
GPS, voice and optional EVDO capabilities give this module a unique
position. The new and improved footprint facilitates soldering.
Physical specifications
>MCM in LGA package
>Dimensions: 31.8 mm x 26.8 mm x 2 mm
>Weight: 5 g
>Operating temperature: -20°C to +70°C
>Storage temperature: -40°C to +85°C
From embedded firmware to a full-featured connection manager, Option supports the entire software chain for embedded modules. Being a Qualcomm and Gobi licensee, Option has full access to the firmware that is running on the Qualcomm baseband processor. This allows Option to make customizations for its customers to support certain features or operator requirements. Drivers are available for the most popular operating systems. For some platforms such as Android®, a RIL (Radio Interface Layer) can be
provided. For other platforms Option can deliver a SDK or a customizable connection manager.
Optional feature packs are available, like:
> "MyCloud"; cloud computing, delivering back-up, synchronisation and file sharing functionalities.
> uCan® Control; a mobil data consumption and warning policy solution for end-users.
Voice features
Voice support
>Basic Telephony and Supplementary services
>Vocoder support for 3GPP and 3GPP2
(Narrowband and Wideband)
>Enhanced Echo Cancellation and Noise Suppression
>Fluence Enhanced Voice Features
>Support for Voice Calibration & Tuning