HL SeriesAirPrime® HL Series Wireless IoT Modules

Sierra Wireless AirPrime® HL Series embedded modules offer everything device manufacturers need to meet essential connectivity requirements for machine-to-machine (M2M) applications such as healthcare, point of sale terminals, fleet management, tracking, and consumer electronics. Key differentiators include a common form factor, small size, low-power consumption, enhanced RF performance, optional GNSS (GPS and GLONASS), and worldwide coverage.

COMPACT: THE SMALLEST 2G TO 4G FORM FACTOR ON THE MARKET
The HL Series is the smallest module on the market sharing a common form factor across 2G, 3G, and 4G technologies. Now, with just one PCB design, device manufacturers can easily integrate voice and data connectivity and deploy in any region, on any wireless mobile network.

FLEXIBLE: SOLDER DOWN OR CHOOSE THE SNAP-IN SOCKET TO SWITCH MODULES ANY TIME
The compact form factor offers the choice of soldering down the module for efficient high-volume production or, using a snap-in socket on the same solder pads for total flexibility in prototyping or smaller volume runs. The innovative snap-in socket allows device manufacturers to deploy or change modules at any point in the production and product life cycles.

FUTURE PROOF: INTELLIGENT PIN-TO-PIN COMPATIBILITY TO SUPPORT EVOLVING TECHNOLOGIES
The core and extension pins on the common form factor enables forward and backward compatibility between the different 2G, 3G, and 4G module variants. This means that the mechanical pin location delivers the same function across the series. The optional custom pins allow for new features as technology evolves making it the most future proof module on the market.

Features
  • GSM/GPRS/EDGE/HSUPA/HSDPA/LTE
  • GNSS (GPS + GLONASS)
  • Dual SIM Dual Standby technology for maximum network connectivity
Benefits
  • Smallest 2G to 4G form factor on the market
  • Use one design for your 2G, 3G, and 4G deployments
  • Device management made easy with ready-to-use firmware upgrades using AirVantage Management Service
  • Choose between LGA solder-down or snap-in integration, for supply-chain and lifecycle management requirements